Description
The Intel Xeon Platinum 8170 is a high-performance server processor designed for demanding workloads such as data centers, cloud computing, and high-performance computing (HPC) environments. With 26 cores and a clock speed of 2.1GHz, it offers superior processing power, enabling users to handle even the most complex computational tasks with ease. Additionally, its 35.75 MB L3 Cache and 10.4 GT/s UPI speed further enhance its performance. The processor is built using the 14nm manufacturing process and has a thermal design power of 165W. The BX806738170 model features the FCLGA3647 socket type, making it compatible with Intel’s scalable platforms.
Intel® Xeon® Platinum processors offer the industry’s best performance for mission-critical and hybrid cloud workloads, real-time analytics, machine learning, and artificial intelligence, with monumental leaps in I/O, memory, storage, and network technologies.
configuration
| General Information | |
|---|---|
| Manufacturer | Intel-IMSourcing |
| Manufacturer Part Number | BX806738170 |
| Manufacturer Website Address | http://www.intel.com |
| Brand Name | Intel |
| Product Line | Xeon Platinum |
| Product Model | 8170 |
| Product Name | Xeon Platinum Hexacosa-core 8170 2.10GHz Server Processor |
| Package Type | Retail |
| Product Type | Processor |
| Technical Information | |
| Processor Manufacturer | Intel |
| Processor Core | Hexacosa-core (26 Core) |
| Clock Speed | 2.10 GHz |
| Overclocking Speed | 3.70 GHz |
| L2 Cache | 26 MB |
| L3 Cache | 35.75 MB |
| 64-bit Processing | Yes |
| Process Technology | 14 nm |
| Processor Socket | Socket 3647 |
| Power Description | |
| Thermal Design Power | 165 W |
| Environmental Conditions | |
| Thermal Specification | 192.2°F (89°C) |
| Physical Characteristics | |
| Width | 3″ |
| Depth | 2.2″ |
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